Title:
SOLID-STATE IMAGING DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/085025
Kind Code:
A1
Abstract:
[Problem] To inhibit the occurrence of distortion. [Solution] A solid-state imaging device according to the present invention comprises: a first substrate comprising a pixel array in which a plurality of pixels that output analog signals through photoelectric conversion are arranged in a two-dimensional array of columns in a first direction and rows in a second direction intersecting the first direction; and a second substrate, layered on the first substrate, comprising an analog circuit that is disposed overlapping the pixel array in a third direction intersecting the first direction and the second direction and that processes the analog signals outputted by the pixels. The pixel array is divided, by a pixel divider running along the second direction, into a first region and a second region respectively comprising continuous pixels. The analog circuit is connected to the pixels belonging to the first region and the pixels belonging to the second region, and is divided, in the third direction, into adjacent first and second analog circuits by a circuit divider that is disposed overlapping the pixel divider.
Inventors:
OKADA CHIHIRO (JP)
ASAKURA LUONGHUNG (JP)
ISEKI KENGO (JP)
ASAKURA LUONGHUNG (JP)
ISEKI KENGO (JP)
Application Number:
PCT/JP2020/037335
Publication Date:
May 06, 2021
Filing Date:
September 30, 2020
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L27/146; H04N5/357; H04N5/369; H04N5/374
Foreign References:
| JP2017183659A | 2017-10-05 | |||
| JP2019068405A | 2019-04-25 | |||
| JP2012054876A | 2012-03-15 |
Attorney, Agent or Firm:
NAKAMURA Yukitaka et al. (JP)
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