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Title:
SOLID-STATE IMAGING ELEMENT AND IMAGING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2021/153287
Kind Code:
A1
Abstract:
A solid-state imaging element according to the present disclosure is provided with a plurality of first photoelectric conversion elements, a plurality of second photoelectric conversion elements, a plurality of current-to-voltage conversion circuits (320, 320A), and a plurality of address event detection circuits (231, 231A). The plurality of first photoelectric conversion elements are arranged side by side in a first region. The plurality of second photoelectric conversion elements are arranged side by side in a second region adjacent to the first region. The plurality of current-to-voltage conversion circuits (320, 320A) respectively convert currents output from the plurality of first photoelectric conversion elements and the plurality of second photoelectric conversion elements into voltages. The plurality of address event detection circuits (231, 231A) respectively detect a change in the voltages output from the plurality of current-to-voltage conversion circuits (320, 320A). The current-to-voltage conversion circuits (320A) and/or the address event detection circuits (231A) connected to the second photoelectric conversion elements suppress the output a signal based on the currents output from the second photoelectric conversion elements.

Inventors:
MURAKAWA YUSUKE (JP)
KITANO SHIN (JP)
NAKAMURA MAKOTO (JP)
HANADA TAKUYA (JP)
TSUCHIMOTO KOYA (JP)
NODA YUKI (JP)
Application Number:
PCT/JP2021/001376
Publication Date:
August 05, 2021
Filing Date:
January 15, 2021
Export Citation:
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Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H04N5/378; H01L21/3205; H01L21/768; H01L23/522; H01L27/146; H04N5/351
Domestic Patent References:
WO2019087472A12019-05-09
Foreign References:
JP2019195135A2019-11-07
JP2018085725A2018-05-31
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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