SOLID-STATE IMAGING ELEMENT AND IMAGING APPARATUS

WIPO Patent Application WO/2021/153287

A1

A solid-state imaging element according to the present disclosure is provided with a plurality of first photoelectric conversion elements, a plurality of second photoelectric conversion elements, a plurality of current-to-voltage conversion circuits (320, 320A), and a plurality of address event detection circuits (231, 231A). The plurality of first photoelectric conversion elements are arranged side by side in a first region. The plurality of second photoelectric conversion elements are arranged side by side in a second region adjacent to the first region. The plurality of current-to-voltage conversion circuits (320, 320A) respectively convert currents output from the plurality of first photoelectric conversion elements and the plurality of second photoelectric conversion elements into voltages. The plurality of address event detection circuits (231, 231A) respectively detect a change in the voltages output from the plurality of current-to-voltage conversion circuits (320, 320A). The current-to-voltage conversion circuits (320A) and/or the address event detection circuits (231A) connected to the second photoelectric conversion elements suppress the output a signal based on the currents output from the second photoelectric conversion elements.

MURAKAWA YUSUKE (JP)
KITANO SHIN (JP)
NAKAMURA MAKOTO (JP)
HANADA TAKUYA (JP)
TSUCHIMOTO KOYA (JP)
NODA YUKI (JP)

PCT/JP2021/001376

August 05, 2021

January 15, 2021

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SONY SEMICONDUCTOR SOLUTIONS CORP (JP)

H01L21/3205; H04N5/378; H01L21/768; H01L23/522; H01L27/146; H04N5/351

WO2019087472A1

2019-05-09

JP2019195135A	2019-11-07
JP2018085725A	2018-05-31
JP2016533140A	2016-10-20

See also references of EP 4099686A4

SAKAI INTERNATIONAL PATENT OFFICE (JP)

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