Title:
SOLID-STATE IMAGING ELEMENT AND IMAGING DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/131771
Kind Code:
A1
Abstract:
The present invention improves the sensitivity of pixels in a solid-state imaging element that performs time delay integration. The solid-state imaging element includes a plurality of photoelectric conversion elements, and a prescribed number of transistors. In this solid-state imaging element, the plurality of photoelectric conversion elements are arrayed along a prescribed direction at prescribed intervals. The size, in the prescribed direction, of each of the plurality of photoelectric conversion elements arrayed at the prescribed intervals does not exceed the prescribed interval. Additionally, in the solid-state imaging element, the prescribed number of transistors are each disposed between the plurality of photoelectric conversion elements, and the transistors generate signals corresponding to an electric charge amount generated by any of the plurality of photoelectric conversion elements.
Inventors:
YAMAZAKI TOMOHIRO (JP)
MURAMATSU YOSHINORI (JP)
MURAMATSU YOSHINORI (JP)
Application Number:
PCT/JP2020/046211
Publication Date:
July 01, 2021
Filing Date:
December 11, 2020
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H04N5/374; H01L27/146; H04N5/3745
Domestic Patent References:
| WO2011142082A1 | 2011-11-17 |
Foreign References:
| JP2019216379A | 2019-12-19 | |||
| JP2018186478A | 2018-11-22 |
Attorney, Agent or Firm:
MARUSHIMA, Toshikazu (JP)
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