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Patent Searching and Data


Title:
SOLID-STATE IMAGING ELEMENT AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/131077
Kind Code:
A1
Abstract:
A solid-state imaging element (1) according to the present disclosure comprises a pixel array unit (10) in which a plurality of light-receiving pixels (11) are two-dimensionally arranged. The light-receiving pixels (11) each include organic photoelectric conversion units (61) and another photoelectric conversion unit. The organic photoelectric conversion units (61) each include: a photoelectric conversion layer (63) composed of an organic semiconductor material; a first electrode (62) positioned on the light incident side of the photoelectric conversion layer (63); and a second electrode (65) positioned on the side opposite to the light incident side of the photoelectric conversion layer (63). The other photoelectric conversion unit is positioned on the side opposite to the light incident side of the organic photoelectric conversion units (61), and subjects a wavelength region, different from that of the organic photoelectric conversion units (61), to photoelectric conversion. A connection wire (51), connected to the second electrodes (65), includes: a metal wire (54) composed of a metal; and a transparent wire (53) composed of a transparent conductive film. The metal wiring (54) extending in the horizontal direction from a peripheral edge section of the respective light-receiving pixel 11 to a peripheral edge section of the pixel array unit (10).

Inventors:
KUGIMIYA KATSUHISA (JP)
Application Number:
PCT/JP2021/044959
Publication Date:
June 23, 2022
Filing Date:
December 07, 2021
Export Citation:
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Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L51/42; H01L27/146; H01L31/10; H04N5/369; H04N5/374
Foreign References:
JPH1084106A1998-03-31
JP2006294654A2006-10-26
JP2003243641A2003-08-29
KR20090022329A2009-03-04
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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