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Title:
SOLID-STATE IMAGING ELEMENT, MANUFACTURING METHOD FOR SAME, CURABLE COMPOSITION FOR FORMING INFRARED CUTOFF FILTER, AND CAMERA MODULE
Document Type and Number:
WIPO Patent Application WO/2014/142259
Kind Code:
A1
Abstract:
 The present invention provides: a solid-state imaging element equipped with an infrared cutoff filter which can suppress the deterioration of the optical properties of three adjacent primary color filters; a manufacturing method for the same; a curable composition for forming the infrared cutoff filter; and a camera module. The solid-state imaging element of the present invention has: a semiconductor substrate; a plurality of photoelectric conversion elements which form a plurality of pixels arrayed on the light-receiving surface side of the semiconductor substrate; and a filter layer which is arranged on the light incident side of the plurality of photoelectric conversion elements, and which corresponds to the plurality of photoelectric conversion elements. The filter layer includes at least: a red color filter through which light in the red color wavelength range passes; a green color filter through which light in the green color wavelength range passes; a blue color filter through which light in the blue color wavelength range passes; and an infrared cutoff filter which blocks infrared light. The infrared cutoff filter is arranged adjacent to at least one of the red color filer, the green color filter, and the blue color filter.

Inventors:
TOMEBA HISAMITSU (JP)
Application Number:
PCT/JP2014/056733
Publication Date:
September 18, 2014
Filing Date:
March 13, 2014
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
G02B5/22; G02B5/20; H01L27/14
Foreign References:
JP2008091535A2008-04-17
JP2012122045A2012-06-28
JP2012021066A2012-02-02
Attorney, Agent or Firm:
WATANABE Mochitoshi et al. (JP)
Mochitoshi Watanabe (JP)
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