Title:
SOLID-STATE IMAGING ELEMENT, SIGNAL PROCESSING METHOD THEREFOR, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2016/035566
Kind Code:
A1
Abstract:
The present disclosure pertains to a solid-state imaging element, a signal processing method, and an electronic device, with which a sensitivity correction is performed to reduce the difference in sensitivity between solid-state imaging elements. The solid-state imaging element has a pixel unit wherein one micro-lens is formed with respect to multiple pixels such that the boundary of the micro-lens coincides with the boundary of the pixels. A correction circuit corrects the difference in sensitivity between the pixels in the pixel unit on the basis of a correction coefficient. The present disclosure can be applied to solid-state imaging elements and the like.
Inventors:
SAKIOKA YOUJI (JP)
TACHI MASAYUKI (JP)
NISHIMAKI HISASHI (JP)
YOSHIDA TAISHIN (JP)
TACHI MASAYUKI (JP)
NISHIMAKI HISASHI (JP)
YOSHIDA TAISHIN (JP)
Application Number:
PCT/JP2015/073463
Publication Date:
March 10, 2016
Filing Date:
August 21, 2015
Export Citation:
Assignee:
SONY CORP (JP)
International Classes:
H04N5/369; H01L27/14; H01L27/146; H04N5/374; H04N9/07
Domestic Patent References:
| WO2014080674A1 | 2014-05-30 | |||
| WO2014050875A1 | 2014-04-03 |
Foreign References:
| JP2007189312A | 2007-07-26 | |||
| JP2002131623A | 2002-05-09 | |||
| JP2010049209A | 2010-03-04 |
Attorney, Agent or Firm:
NISHIKAWA Takashi et al. (JP)
Nishikawa 孝 (JP)
Nishikawa 孝 (JP)
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