Title:
SOLVENT BASED CONDUCTIVE PASTE FOR 3D PRINTING
Document Type and Number:
WIPO Patent Application WO/2020/093898
Kind Code:
A1
Abstract:
A thixotropic, solvent-based conductive paste capable of 3D printing by a micro-dispensing nozzle is provided. The conductive paste includes approximately 50 weight percent to approximately 80 weight percent conductive flakes having a ratio of the largest flake dimension to the smallest flake dimension (aspect ratio) of at least approximately 50. The paste includes a resin in an amount of less than approximately 20 weight percent, a solvent in an amount of less than approximately 40 weight percent, a surfactant in an amount of less than approximately 5 weight percent and a thixotropic agent in an amount of less than approximately 5 weight percent. The conductive paste has a viscosity of approximately 10,000 to 100,000 centipoise, a curing temperature of approximately 90℃ to approximately 120℃. The sheet resistance of a cured film formed from the conductive paste is approximately 10 micro-ohms to approximately 50 micro-ohms per square.
Inventors:
WANG YUECHEN (CN)
FU LI (CN)
FU LI (CN)
Application Number:
PCT/CN2019/113676
Publication Date:
May 14, 2020
Filing Date:
October 28, 2019
Export Citation:
Assignee:
NANO & ADVANCED MATERIALS INST LTD (CN)
International Classes:
H01B1/22; C08K3/08; H01B1/20; H01B13/00
Foreign References:
| US20170236613A1 | 2017-08-17 | |||
| CN105632591A | 2016-06-01 | |||
| CN105733198A | 2016-07-06 | |||
| CN107610803A | 2018-01-19 | |||
| CN106751908A | 2017-05-31 | |||
| US20160319150A1 | 2016-11-03 |
Attorney, Agent or Firm:
IDEA INTELLECTUAL (SHENZHEN) IP AGENCY (CN)
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