SOLVENT COMPOSITION, CLEANING METHOD, COATING FILM FORMING COMPOSITION, AND COATING FILM FORMING METHOD

Title:

SOLVENT COMPOSITION, CLEANING METHOD, COATING FILM FORMING COMPOSITION, AND COATING FILM FORMING METHOD

Document Type and Number:

WIPO Patent Application WO/2017/138562

Kind Code:

A1

Abstract:

Provided are: a solvent composition which includes tDCE, does not have negative impacts on the Earth's environment, has high solubility and is nonflammable, and can maintain an initial nonflammability even in use that involves phase changes; a cleaning method of products using the solvent composition; a coating film forming composition in which volatile components thereof do not have negative impacts on the Earth's environment in use, which is safe by being nonflammable, and with which a homogeneous coating film can be formed; and a method for forming the homogeneous coating film by using the coating film forming composition. The solvent composition includes tDCE, a first HFE (including at least one HFE selected from HFE-347pc-f, HFE-365mf-c, and HFE-467sc-f) having a boiling point of 40-65°C, and a second HFE having a boiling point of 70-120°C, a ratio of tDCE being 65-80% by mass, a ratio of the first HFE being 5-25% by mass, and a ratio of the second HFE being 5-25% by mass with respect to the total of tDCE, the first HFE, and the second HFE.

Inventors:

IKEDA DAISUKE (JP)
MITSUOKA HIROAKI (JP)
MIKI TOSHIO (JP)
HANADA TSUYOSHI (JP)

Application Number:

PCT/JP2017/004568

Publication Date:

August 17, 2017

Filing Date:

February 08, 2017

Export Citation:

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Assignee:

ASAHI GLASS CO LTD (JP)

International Classes:

C11D7/50; B08B3/08; B08B3/12; C09D7/12; C09D127/12; C09D183/04; C09D201/00; C10M107/38; C10M107/50; C23G5/028; C10N30/00; C10N40/20

Domestic Patent References:

WO2004005445A1

2004-01-15

Foreign References:

JP2005048097A	2005-02-24
JPH10324652A	1998-12-08
JP2005523991A	2005-08-11
JPH11505249A	1999-05-18

Other References: