Title:
SOLVENT-SOLUBLE ELASTIC RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2014/141984
Kind Code:
A1
Abstract:
Provided is a resin composition which is soluble in solvents and can keep adhesion properties thereof in a wide temperature range. A solvent-soluble elastic resin composition comprising a crystalline polyether segment (a) and an amorphous polyester segment (b), said solvent-soluble elastic resin composition being characterized in that the storage modulus (E'20) at 20˚C is 800 to 2000 MPa, the storage modulus (E'80) at 80˚C is 0.5 to 2.5 MPa, and the ratio of the storage modulus at 80˚C to the storage modulus at 20˚C (i.e., E'80/E'20) is 0.025 to 0.25% as measured at a frequency of 10 Hz.
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Inventors:
SAKAI JUNKO (JP)
SHIGA KENJI (JP)
SHIGA KENJI (JP)
Application Number:
PCT/JP2014/055722
Publication Date:
September 18, 2014
Filing Date:
March 06, 2014
Export Citation:
Assignee:
TOYO BOSEKI (JP)
International Classes:
C08L67/00; C08K5/134; C08K5/5333; C09J11/06; C09J167/00
Foreign References:
| JPH09263749A | 1997-10-07 | |||
| JP2010083962A | 2010-04-15 | |||
| JP2003040990A | 2003-02-13 | |||
| JP2008231358A | 2008-10-02 | |||
| JP2013072009A | 2013-04-22 |
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