Title:
SOLVENTLESS ADHESIVE COMPOSITIONS AND LAMINATE MATERIALS PREPARED THEREFROM
Document Type and Number:
WIPO Patent Application WO/2023/004744
Kind Code:
A1
Abstract:
Disclosed is a solventless adhesive composition comprising (A) an isocyanate component obtained by the reaction of reactants comprising at least one monomeric cycloaliphatic isocyanate compound and at least one first polyol; and (B) a polyol component comprising particularly selected polyols. The solventless adhesive composition can be used for the production of laminate materials, e.g. laminate backsheet of a photovoltaic device, which well meets the requirements of various compliance regulations and has superior performance properties such as bond strength, aging resistance, yellowing resistance, delamination resistance, and the like. A method for producing said laminate material and the resultant laminate material are also disclosed.
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Inventors:
BAI CHENYAN (CN)
SCHIMIDT THORSTEN (CH)
SCHIMIDT THORSTEN (CH)
Application Number:
PCT/CN2021/109572
Publication Date:
February 02, 2023
Filing Date:
July 30, 2021
Export Citation:
Assignee:
DOW GLOBAL TECHNOLOGIES LLC (US)
BAI CHENYAN (CN)
SCHIMIDT THORSTEN (CH)
BAI CHENYAN (CN)
SCHIMIDT THORSTEN (CH)
International Classes:
C09J175/04; B32B37/12; C09J175/06; C09J175/08
Domestic Patent References:
| WO2020199175A1 | 2020-10-08 | |||
| WO2020227964A1 | 2020-11-19 | |||
| WO2020227962A1 | 2020-11-19 |
Foreign References:
| CN107922582A | 2018-04-17 | |||
| CN110352206A | 2019-10-18 | |||
| CN107849213A | 2018-03-27 |
Attorney, Agent or Firm:
SHANGHAI PATENT & TRADEMARK LAW OFFICE, LLC (CN)
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