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Patent Searching and Data


Title:
SOLVENTLESS PRESSURE SENSITIVE ADHESIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2022/170507
Kind Code:
A1
Abstract:
A process for preparing a solventless pressure sensitive adhesive composition comprising mixing (A) a solid polyorganosilicate resin component with (B) an aliphatically unsaturated polydiorganosiloxane (B-1), a branched polyorganosiloxane (B-2), or a mixture of (B-1) and (B-2), at certain temperatures, followed by cooling. The solventless pressure sensitive adhesive composition prepared by the process has a low viscosity and can be cured to form pressure sensitive adhesives. The pressure sensitive adhesives are suitable for protective film applications.

Inventors:
FAN RONGRONG (CN)
LIU ZHIHUA (CN)
CAO QING (CN)
XU XIAOCONG (CN)
ZHU JIAYIN (CN)
Application Number:
PCT/CN2021/076335
Publication Date:
August 18, 2022
Filing Date:
February 09, 2021
Export Citation:
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Assignee:
DOW SILICONES CORP (US)
FAN RONGRONG (CN)
LIU ZHIHUA (CN)
CAO QING (CN)
XU XIAOCONG (CN)
ZHU JIAYIN (CN)
International Classes:
C08G77/12; C08G77/00; C08G77/20; C08L83/04; C09J7/38; C09J183/04
Foreign References:
EP3757186A12020-12-30
US20060189767A12006-08-24
US2676182A1954-04-20
US4611042A1986-09-09
US4774310A1988-09-27
US8017712B22011-09-13
US10351742B22019-07-16
US6806339B22004-10-19
US20070289495A12007-12-20
US3159601A1964-12-01
US3220972A1965-11-30
US9593209B22017-03-14
Attorney, Agent or Firm:
KING & WOOD MALLESONS (CN)
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