Title:
SOUND-ABSORBING MATERIAL
Document Type and Number:
WIPO Patent Application WO/2020/213139
Kind Code:
A1
Abstract:
The present disclosure pertains to a sound-absorbing material comprising, in the following order: a resin film; a first substrate layer having communication holes; and a second substrate layer having communication holes.
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Inventors:
TAKAYASU SATOSHI (JP)
KOTAKE TOMOHIKO (JP)
KOTAKE TOMOHIKO (JP)
Application Number:
PCT/JP2019/016685
Publication Date:
October 22, 2020
Filing Date:
April 18, 2019
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
G10K11/16; B32B5/22; E04B1/86; G10K11/168
Foreign References:
| JPH11242486A | 1999-09-07 | |||
| JP2012024955A | 2012-02-09 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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