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Title:
SOUND-INSULATING FLOOR STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2014/199964
Kind Code:
A1
Abstract:
The present invention minimizes the occurrence of vibration that has an adverse effect on floor impact sound resulting from a heavy weight and vibration that is caused by walking on a floor in a floor structure by limiting the rotation and twisting of a plurality of floor panels on floor beams. A floor structure (1) is provided on each of floor panels (4) so as to span a plurality of the floor panels (4), and is provided with a connection member (5) that connects the plurality of floor panels (4). The connection member (5) is provided with: a cover plate (5a) that covers the plurality of floor panels (4) from above; and a damping material (5b) that is provided between the cover plate (5a) and the plurality of floor panels (4) so as to absorb relative displacement energy by undergoing shearing deformation when the bottom surface of the cover plate (5a) and the upper surfaces of the plurality of floor panels (4) are displaced relative to one another in a direction that follows each of the surfaces.

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Inventors:
NAGAMATSU HIDEO (JP)
KONISHI TAKEO (JP)
KURIHARA HIDEKI (JP)
MATSUDA YOSHIFUMI (JP)
ABE HIROYUKI (JP)
Application Number:
PCT/JP2014/065280
Publication Date:
December 18, 2014
Filing Date:
June 10, 2014
Export Citation:
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Assignee:
SEKISUI HOUSE KK (JP)
International Classes:
E04F15/18; E04B5/43; E04F15/20
Foreign References:
JP2012202107A2012-10-22
JPH0821073A1996-01-23
JPH10259658A1998-09-29
JP3713653B22005-11-09
JP4226397B22009-02-18
JP2000145119A2000-05-26
Attorney, Agent or Firm:
KOTANI, Etsuji et al. (JP)
Etsuji Kotani (JP)
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