SOUND-INSULATING STRUCTURAL BODY - MITSUBISHI CHEM CORP

Title:

SOUND-INSULATING STRUCTURAL BODY

Document Type and Number:

WIPO Patent Application WO/2022/065487

Kind Code:

A1

Abstract:

The present invention addresses the problem of providing a sound-insulating structural body capable of achieving a high sound-insulation effect when an uneven structural body that has an uneven structure is installed on a member having high rigidity. The sound-insulating structural body has: a flexible member where the load that imparts a strain rate of 4% in a compression test conducted by using a compression tester is 160 kPa or less; an adherend on which the flexible member is installed; and an uneven sheet member having an uneven structure that has a sheet part and protruding parts provided to the surface of the sheet part. The flexible member is provided so as to be disposed between the adherend and the uneven sheet member.

Inventors:

NAKAYAMA MASANARI (JP)
SAITO YUYA (JP)
UCHIDA NAOYUKI (JP)
INOUE KAZUMA (JP)
KOSHITOUGE HARUKI (JP)

Application Number:

PCT/JP2021/035397

Publication Date:

March 31, 2022

Filing Date:

September 27, 2021

Export Citation:

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Assignee:

MITSUBISHI CHEM CORP (JP)

International Classes:

E04B1/86; G10K11/16; G10K11/168

Domestic Patent References:

WO2020162602A1	2020-08-13
WO2017135409A1	2017-08-10
WO2017135409A1	2017-08-10

Foreign References:

JP2000265593A	2000-09-26
JP2013231316A	2013-11-14
JP2017227109A	2017-12-28
JP2000265593A	2000-09-26

Other References: