Title:
SOUNDPROOF STRUCTURAL BODY AND SOUNDPROOF UNIT
Document Type and Number:
WIPO Patent Application WO/2020/036027
Kind Code:
A1
Abstract:
Provided are: a soundproof structural body utilizing Helmholtz resonance, which can be reduced in size and thickness; and a soundproof unit. This soundproof structural body is provided with a housing having a space formed therein and having a through-hole for connecting the space and the outside, and generates Helmholtz resonance by means of the space and the through-hole. When viewed in the direction in which the through-hole extends, the soundproof structural body has a rear surface plate at a position on the space side, which overlaps the through-hole. If the diameter of the through-hole is Φ, and the distance from the rear surface plate to the space-side open face of the through-hole is d, then the relationships of d ≤ φ and d ≤ 6 mm are satisfied.
Inventors:
HAKUTA SHINYA (JP)
Application Number:
PCT/JP2019/027646
Publication Date:
February 20, 2020
Filing Date:
July 12, 2019
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G10K11/172; E04B1/86; G10K11/16; G10K11/162
Domestic Patent References:
WO2004061817A1 | 2004-07-22 |
Foreign References:
JP2007047560A | 2007-02-22 | |||
JP2004279779A | 2004-10-07 | |||
JP2000099034A | 2000-04-07 | |||
JP2008278476A | 2008-11-13 | |||
JPH10333686A | 1998-12-18 |
Attorney, Agent or Firm:
ITOH Hideaki et al. (JP)
Download PDF:
Previous Patent: METHOD FOR PRODUCING TUNGSTEN HEXAFLUORIDE
Next Patent: PARTITIONING MATERIAL, VEHICLE, AND ELECTRONIC DEVICE
Next Patent: PARTITIONING MATERIAL, VEHICLE, AND ELECTRONIC DEVICE