Title:
SPEAKER MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2010/050062
Kind Code:
A1
Abstract:
A speaker manufacturing method which shortens a time for manufacturing a speaker by shortening a time for curing an a moisture-curing adhesive when using the adhesive. The method has a wetting process of locally wetting either or both of the joining places of one and the other constructional members in advance of joining and an adhesive application process of applying the moisture-curing adhesive to either or both of the joining places of the one and the other constructional members. The wetting process, by use of a water jet nozzle jetting the water or water solution to a set range, wets the whole of the joining places while aiming the water or water solution jetted from the water jet nozzle toward the joining places and moving the water jet nozzle relatively with respect to the one or the other constructional member.
Inventors:
MATSUDA MICHIRO (JP)
HANZAWA KEN (JP)
MAKI NOBUYUKI (JP)
HANZAWA KEN (JP)
MAKI NOBUYUKI (JP)
Application Number:
PCT/JP2008/069943
Publication Date:
May 06, 2010
Filing Date:
October 31, 2008
Export Citation:
Assignee:
PIONEER CORP (JP)
PIONEER TOHOKU CORP (JP)
MATSUDA MICHIRO (JP)
HANZAWA KEN (JP)
MAKI NOBUYUKI (JP)
PIONEER TOHOKU CORP (JP)
MATSUDA MICHIRO (JP)
HANZAWA KEN (JP)
MAKI NOBUYUKI (JP)
International Classes:
H04R31/00; H04R9/02; H04R9/04
Foreign References:
| JP2007325017A | 2007-12-13 | |||
| JPH06349655A | 1994-12-22 | |||
| JPS59206073A | 1984-11-21 | |||
| JPH01502436A | 1989-08-24 | |||
| JPH05291351A | 1993-11-05 | |||
| JPH07114974A | 1995-05-02 |
Attorney, Agent or Firm:
EICHI Patent & Trademark Corp. et al. (JP)
Patent business corporation Wisdom international patent firm (JP)
Patent business corporation Wisdom international patent firm (JP)
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