Title:
SPHERICAL DRIVE ASSEMBLY FOR CHEMICAL MECHANICAL PLANARIZATION
Document Type and Number:
WIPO Patent Application WO2002060643
Kind Code:
A9
Abstract:
The present invention provides an improved planarization or polishing apparatus for chemical mechanical planarization and other types of polishing such as metal polishing and optical polishing. In an exemplary embodiment, an apparatus for polishing an object (115) comprises a pad (117) having a polishing surface to be placed on the target surface of the object (115) to be polished. A pad drive member (116) is connected to the pad to move the pad relative to the object to chenge a position of the polishing surface of the pad on the target surface of the object. A drive support (251) is movably coupled with the pad drive member (116) to support the pad drive member (116) for rotation relative to the drive support around a pivot point (252) which is disposed substantially on the target surface of the object (115) during polishing.
Inventors:
HALLEY DAVID G
Application Number:
PCT/US2001/051079
Publication Date:
September 12, 2003
Filing Date:
October 23, 2001
Export Citation:
Assignee:
STRASBAUGH (US)
International Classes:
B24B9/06; B24B37/04; B24B41/04; B24B47/10; B24B49/02; B24B49/12; B24B53/007; B24B57/02; H01L21/304; H01L21/687; (IPC1-7): B24B7/22; B24B49/02; B24B1/00
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