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Title:
SPHERICAL INORGANIC POWDER AND LIQUID SEALING MATERIAL
Document Type and Number:
WIPO Patent Application WO/2022/210260
Kind Code:
A1
Abstract:
[Problem] To provide an inorganic powder capable of giving a resin composition having excellent fluidity and capable of preventing an increase in agglomerated particles in a resin composition. [Solution] A spherical inorganic powder having, in a frequency particle size distribution, a first peak having a maximum value in the particle size range of 0.1-0.6 μm (inclusive), and a second peak having a maximum value in the particle size range of 1.5-5.0 μm (inclusive), the value of the ratio of the frequency at the maximum value of the second peak to the frequency at the maximum value of the first peak being 1.5 to less than 10.0.

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WO/2023/090135LIQUID DISPERSION OF PARTICLES EACH HAVING SHELL CONTAINING FUNCTIONAL GROUP AND SILICON AND VOID IN SAID SHELL, AND METHOD FOR PRODUCING SAID LIQUID DISPERSION
Inventors:
MINAMIKAWA TAKAAKI (JP)
YAMAMOTO AKIHIKO (JP)
FUKUDA TAKASHI (JP)
Application Number:
PCT/JP2022/013954
Publication Date:
October 06, 2022
Filing Date:
March 24, 2022
Export Citation:
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Assignee:
DENKA COMPANY LTD (JP)
International Classes:
C01B33/18; C08K3/36; C08L101/00; H01L23/29; H01L23/31
Foreign References:
JP2007132704A2007-05-31
JP2003003074A2003-01-08
JP2007119662A2007-05-17
JP2019044006A2019-03-22
JP2014197649A2014-10-16
JP2005239892A2005-09-08
JP2003221224A2003-08-05
Attorney, Agent or Firm:
SONODA & KOBAYASHI INTELLECTUAL PROPERTY LAW (JP)
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