Title:
SPHERICAL SILVER POWDER AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2019/117235
Kind Code:
A1
Abstract:
Provided are: a spherical silver powder, which has a particle size similar to spherical silver powder produced by a conventional wet reduction method and with which, when used in a sinterable electrically conductive paste, an electrically conductive film of low volume resistivity can be formed by thoroughly sintering silver particles with each other at a relatively low temperature; and a production method therefor. In an aqueous reaction system containing silver ions, after adding a neutral or basic amino acid of at least five carbons (such as proline, tyrosine, tryptophan, phenylalanine, arginine, or histidine), a reducing agent is mixed to reduce and deposit silver particles. As a result, spherical silver powder is produced which contains a neutral or basic amino acid of at least five carbons inside the particles and for which the average particle size D50 measured by laser diffraction is 0.2-5 μm.
Inventors:
OSAKO MASAYA (JP)
Application Number:
PCT/JP2018/045812
Publication Date:
June 20, 2019
Filing Date:
December 13, 2018
Export Citation:
Assignee:
DOWA ELECTRONICS MATERIALS CO (JP)
International Classes:
B22F9/24; B22F1/00; H01B1/00; H01B1/02; H01B1/22; H01B5/00; H01B13/00
Foreign References:
| JP2011021252A | 2011-02-03 | |||
| JP2012214873A | 2012-11-08 | |||
| JP2008255370A | 2008-10-23 | |||
| JPH08176620A | 1996-07-09 |
Other References:
See also references of EP 3702073A4
Attorney, Agent or Firm:
OKAWA Koichi (JP)
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