Title:
SPOUT PLUG AND PACKAGING CONTAINER USING SAME
Document Type and Number:
WIPO Patent Application WO/2024/085198
Kind Code:
A1
Abstract:
Provided is a spout plug and a packaging container using the same with which the formation of pin holes at weld sites is suppressed, even if ultrasonic welding has been performed under high energy conditions using a fast-fill device. This spout plug has a spout and a cap which is attached to the spout by screwing. The spout comprises an annular base part, a cylindrical spout part connected to an upper end of the base part, and a flat plate-shaped flange part extending outward from a lower end of the base part. The lower surface of the flange part and the base part is a flat surface, and the base part includes a first annular portion having a tapered inner peripheral surface, the inner diameter of which widens from the upper end side to the lower end side.
Inventors:
HONJO Mika
KAWASAKI Minoru
WADA Kiyoshi
KAWASAKI Minoru
WADA Kiyoshi
Application Number:
PCT/JP2023/037754
Publication Date:
April 25, 2024
Filing Date:
October 18, 2023
Export Citation:
Assignee:
TOPPAN HOLDINGS INC. (Taito Taito-k, Tokyo 16, JP)
International Classes:
B65D5/74
Attorney, Agent or Firm:
OGASAWARA PATENT OFFICE (13th Floor 1-23-101, Esakacho, Suita-sh, Osaka 63, JP)
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