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Patent Searching and Data


Title:
SPUNBOND NONWOVEN FABRIC
Document Type and Number:
WIPO Patent Application WO/2023/090200
Kind Code:
A1
Abstract:
In order to provide a spunbond nonwoven fabric that is lightweight but strong, has excellent flexibility, and feels good on the skin, this spunbond nonwoven fabric comprises sheath-core bicomponent fibers having a polypropylene resin as the principal constituent. The spunbond nonwoven fabric has a fused section and an unfused section. The bicomponent fibers in the unfused section have at least two softening temperatures Ts (°C), and the difference (Tsh-Tsl) between the highest softening temperature Tsh (°C) and the lowest softening temperature Tsl (°C) is 5-30°C.

Inventors:
SHIMADA DAIKI (JP)
NAKAJIMA ITARU (JP)
KOIDE GEN (JP)
Application Number:
PCT/JP2022/041499
Publication Date:
May 25, 2023
Filing Date:
November 08, 2022
Export Citation:
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Assignee:
TORAY INDUSTRIES (JP)
International Classes:
D04H3/16; D04H3/007; D04H3/147
Foreign References:
JPH1088455A1998-04-07
JP2001355176A2001-12-26
JP2007523233A2007-08-16
JP2001146674A2001-05-29
JP2000064168A2000-02-29
JP2007308868A2007-11-29
JPS5438214B11979-11-20
US20050041321A12005-02-24
JP2022132044A2022-09-07
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