Title:
SPUTTERING APPARATUS AND FILM FORMATION METHOD
Document Type and Number:
WIPO Patent Application WO/2023/032041
Kind Code:
A1
Abstract:
A sputtering apparatus provided with a treatment chamber, a substrate holder for holding a substrate on a substrate-holding surface in a treatment space in the treatment chamber, a first target holder for holding a first target so that a first surface of the first target faces the treatment space, and a second target holder for holding a second target so that a second surface of the second target faces the treatment space, wherein the first target holder holds the first target so that the orthogonal projection vector of a first normal vector of the first surface on an imaginary plane containing the substrate-holding surface directs away from the substrate, and the second target holder holds the second target so that the orthogonal projection vector of a second normal vector of the second surface on the imaginary plane directs away from the substrate.
Inventors:
KARINO SUSUMU (JP)
TODA TETSURO (JP)
FUJIHARA TOORU (JP)
TODA TETSURO (JP)
FUJIHARA TOORU (JP)
Application Number:
PCT/JP2021/031983
Publication Date:
March 09, 2023
Filing Date:
August 31, 2021
Export Citation:
Assignee:
CANON ANELVA CORP (JP)
International Classes:
C23C14/34
Foreign References:
| US20080121514A1 | 2008-05-29 | |||
| JP2004346387A | 2004-12-09 | |||
| JP2016108610A | 2016-06-20 | |||
| JP2019502030A | 2019-01-24 |
Attorney, Agent or Firm:
OHTSUKA PATENT OFFICE, P.C. (JP)
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