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Title:
SPUTTERING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2023/176569
Kind Code:
A1
Abstract:
A sputtering apparatus (1) deposits a conductive film (22) by sputtering on one side of a base material (21) in the thickness direction while conveying the base material (21) in a roll-to-roll fashion. The sputtering apparatus (1) has a deposition roll (6), a take-up roll (5), and a downstream guide roll unit (8). The downstream guide roll unit (8) is located between the deposition roll (6) and the take-up roll (5) in the conveyance direction. The downstream guide roll unit (8) guides a conductive sheet (20) to the take-up roll (5). The downstream guide roll unit (8) includes a conductive first guide roll (81) and a first resistor (811). The first guide roll (81) can make first contact with a conductive film (22). The first guide roll (81) is connected to ground (9). The first resistor (811) is located between the first guide roll (81) and ground (9).

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WO/2001/083392GLASS COATED WITH HEAT REFLECTING COLORED FILM AND METHOD FOR MANUFACTURING THE SAME
WO/2023/169140HIGH-THROUGHPUT THIN FILM DEPOSITION APPARATUS, ETCHING APPARATUS AND ETCHING METHOD
JPH07100852[Title of Invention] ITO Sputtering Target
Inventors:
NISHIJIMA HIROSHI (JP)
KOZASA JUNPEI (JP)
NOBESAWA HIDEKI (JP)
Application Number:
PCT/JP2023/008473
Publication Date:
September 21, 2023
Filing Date:
March 07, 2023
Export Citation:
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Assignee:
NITTO DENKO CORP (JP)
International Classes:
C23C14/34; C23C14/56
Foreign References:
JP2008248266A2008-10-16
JPS6130669A1986-02-12
JPS6431962A1989-02-02
Attorney, Agent or Firm:
IKUMI PATENT ATTORNEYS OFICE (JP)
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