Title:
SPUTTERING METHOD AND SPUTTERING DEVICE FOR PERFORMING MAGNETRON SPUTTERING ON ROTARY TARGET MATERIAL
Document Type and Number:
WIPO Patent Application WO/2023/216863
Kind Code:
A1
Abstract:
Disclosed in the present application are a sputtering method and a sputtering device for performing magnetron sputtering on a rotary target material. The sputtering method comprises: acquiring, online, morphology information of a target material which is located in a vacuum chamber; generating an outer diameter morphology fitting graph of the target material according to the morphology information of the target material; and according to the outer diameter morphology fitting graph, controlling magnetic field intensities at a plurality of positions of the target material in an axial direction, so that the target material is uniformly consumed.
Inventors:
ZHANG YONGSHENG (CN)
XIE CHUANJIA (CN)
WU RUIJUN (CN)
MO CHAOCHAO (CN)
YANG XIXI (CN)
PENG XIAOLONG (CN)
ZHOU ZHENGUO (CN)
XIE CHUANJIA (CN)
WU RUIJUN (CN)
MO CHAOCHAO (CN)
YANG XIXI (CN)
PENG XIAOLONG (CN)
ZHOU ZHENGUO (CN)
Application Number:
PCT/CN2023/090285
Publication Date:
November 16, 2023
Filing Date:
April 24, 2023
Export Citation:
Assignee:
SUZHOU MAXWELL TECH CO LTD (CN)
International Classes:
C23C14/35; C23C14/54
Foreign References:
| CN114774877A | 2022-07-22 | |||
| CN205133729U | 2016-04-06 | |||
| CN106958011A | 2017-07-18 | |||
| KR20050006501A | 2005-01-17 | |||
| CN111428417A | 2020-07-17 |
Attorney, Agent or Firm:
BEYOND ATTORNEYS AT LAW (CN)
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