STACK STRUCTURE OF PRINTED CIRCUIT BOARDS USING INTERPOSER AND ELECTRONIC DEVICE INCLUDING THE SAME

Title:

STACK STRUCTURE OF PRINTED CIRCUIT BOARDS USING INTERPOSER AND ELECTRONIC DEVICE INCLUDING THE SAME

Document Type and Number:

WIPO Patent Application WO/2020/171452

Kind Code:

A1

Abstract:

An electronic device is disclosed, including: a first support member including at least one screw-fastening portion; a first printed circuit board (PCB) stacked on the first support member and including at least one screw-fixing portion facing the at least one screw-fastening portion; a second PCB spaced apart from the first PCB, including a first screw guide groove; an interposer disposed between the first PCB and the second PCB electrically connecting them and including a second screw guide groove facing the first screw guide groove; and a second support member stacked on the second PCB and including a screw inlet portion facing the first screw guide groove. The second support member, the first PCB, and the first support member are fixed to each other via a screw inserted through the screw inlet portion.

Inventors:

PARK JUNGSIK (KR)
YUN INKUK (KR)
LEE SUNGHYUP (KR)
JUNG HEESEOK (KR)
KWAK WOONGEUN (KR)

Application Number:

PCT/KR2020/001834

Publication Date:

August 27, 2020

Filing Date:

February 10, 2020

Export Citation:

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Assignee:

SAMSUNG ELECTRONICS CO LTD (KR)

International Classes:

H05K1/14; H04M1/02; H05K1/11

Foreign References:

US5703753A	1997-12-30
US20180235071A1	2018-08-16
US20130343015A1	2013-12-26
JP2006222341A	2006-08-24
US20130148322A1	2013-06-13
EP1081994A2	2001-03-07
US5703753A	1997-12-30
US20180235071A1	2018-08-16

Other References: