Title:
STACKING-TYPE ATOMIC LAYER DEPOSITION DEVICE AND METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2015/034208
Kind Code:
A1
Abstract:
The present invention relates to atomic layer deposition and is configured such that multiple unit process chambers for an atomic layer deposition process, upper and lower portions of the unit process chambers being able to be separated from and coupled to each other, are arranged in a stacking type; a separate vacuum chamber for forming vacuum and adjusting pressure is implemented outside the multiple process chambers arranged in a stacking type; accordingly, atomic layer deposition processes can proceed simultaneously in the multiple process chambers implemented to have minimum spaces enabling optimum processes; as a result, productivity can be improved while reducing the amount of use of raw material precursors and reaction precursors and decreasing costs through process time minimization. In addition, inside the optimized process chambers, substrates, on which atomic layers are to be deposited, are perfectly fastened to the upper process chambers or lower process chambers, thereby preventing formation of layers on the rear surfaces of the substrates.
Inventors:
LEE CHOON SOO (KR)
JEONG HONG KI (KR)
JEONG HONG KI (KR)
Application Number:
PCT/KR2014/008050
Publication Date:
March 12, 2015
Filing Date:
August 29, 2014
Export Citation:
Assignee:
KORNIC ENC CO LTD (KR)
International Classes:
C23C16/448; C23C16/455
Foreign References:
| KR20120140627A | 2012-12-31 | |||
| KR20110092825A | 2011-08-18 | |||
| KR20090015378A | 2009-02-12 | |||
| KR20120066853A | 2012-06-25 |
Attorney, Agent or Firm:
FIRSTLAW P.C. (KR)
제일특허법인 (KR)
제일특허법인 (KR)
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