STAINLESS STEEL MATERIAL FOR DIFFUSION BONDING

WIPO Patent Application WO/2016/072244

A1

Provided is a stainless steel material suitable for diffusion bonded moldings in which diffusion bondability has been further improved without being affected by the extent of surface roughness. The present invention is a stainless steel material for diffusion bonding in which the metal structure before diffusion bonding has a multi-phase structure obtained from two or more of a ferrite phase, a martensite phase and an austenite phase, wherein: the mean crystal grain diameter in the multi-phase structure is not more than 20 µm; γmax represented by formula (a) is 10-90; and creep elongation when a 1.0 MPa load is applied at 1000°C for 0.5 h is at least 0.2%. γmax=420C-11.5Si+7Mn+23Ni-11.5Cr-12Mo+9Cu-49Ti-47Nb-52Al+470N+189 ∙∙∙ Formula (a) The element notations in formula (a) represent the contents (mass%) of the respective elements.

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SUGAMA ATSUSHI (JP)
KAGEOKA KAZUYUKI (JP)
HORI YOSHIAKI (JP)
IMAKAWA KAZUNARI (JP)
OKU MANABU (JP)

PCT/JP2015/079342

May 12, 2016

October 16, 2015

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NISSHIN STEEL CO LTD (JP)

C22C38/00; C22C38/58

JP2013103271A	2013-05-30
JPH07256468A	1995-10-09
JP2013011437A	2013-01-17
JP2013173181A	2013-09-05
JP2010090456A	2010-04-22
JP2014185369A	2014-10-02
JP2014190664A	2014-10-06
US20090072009A1	2009-03-19

See also references of EP 3216888A4

HAYASHI, Kazuyoshi et al. (JP)
Wood Kazuyoshi (JP)

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