Title:
STRESS SENSOR AND STRESS SENSOR MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/214544
Kind Code:
A1
Abstract:
Provided is a stress sensor that can detect stress and shear force, that has high detection accuracy, and that can achieve a reduction in thickness. This stress sensor comprises a first base material, a second base material, three or more detection units disposed between the first base material and the second base material, and a bonding layer that is provided to a region surrounding a detection region including the three or more detection units, and that bonds the first base material and the second base material. The area of one among the a first electrode and a second electrode is smaller than the area of the other, and is equal to the overlapping area of the first electrode and the second electrode. If the number of detection units is n, the number of detection units on an arbitrary straight line passing through the geometric center of the detection region is not less than one, and not greater than (n-1).
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Inventors:
ZHANG HONGLI
OOHARA TAKANORI
OOHARA TAKANORI
Application Number:
PCT/JP2023/016869
Publication Date:
November 09, 2023
Filing Date:
April 28, 2023
Export Citation:
Assignee:
TOPPAN INC (JP)
International Classes:
G01L5/1623; G01L1/20
Foreign References:
| JP2015158431A | 2015-09-03 | |||
| JP2014163815A | 2014-09-08 | |||
| JP2001165788A | 2001-06-22 | |||
| US20160015311A1 | 2016-01-21 |
Attorney, Agent or Firm:
OGASAWARA PATENT OFFICE (JP)
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