Title:
STRIP-SHAPED COPPER ALLOY MATERIAL, SEMICONDUCTOR LEAD FRAME USING SAME, SEMICONDUCTOR INTEGRATED CIRCUIT AND ELECTRONIC DEVICE, AND METHOD FOR PRODUCING LEAD FRAME AND METHOD FOR USING STRIP-SHAPED COPPER ALLOY MATERIAL AS LEAD FRAME
Document Type and Number:
WIPO Patent Application WO/2023/188748
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a strip-shaped copper alloy material that exhibits a high strength and that suppresses the production of burring during cutting. The present invention is a strip-shaped copper alloy material composed of Si at more than 0.1 mass%, Ni, and a balance of copper and unavoidable impurities. The strip-shaped copper alloy material has a 0.2% proof stress, as measured by a prescribed method, of at least 550 MPa, and has an elongation at break, measured by a prescribed method wherein heating is performed for 30 minutes at 400°C followed by standing in an air atmosphere and reducing the temperature of the copper alloy to room temperature, of not more than 10%.
Inventors:
NAKATSUMA MUNEHIKO (JP)
Application Number:
PCT/JP2023/002212
Publication Date:
October 05, 2023
Filing Date:
January 25, 2023
Export Citation:
Assignee:
JX METALS CORP (JP)
International Classes:
C22C9/06; C22C9/00; C22C9/02; C22C9/04; C22C9/05; C22C9/10; C22F1/00; C22F1/08; H01B1/02; H01B5/02
Foreign References:
| JP2020158837A | 2020-10-01 | |||
| JP2017179407A | 2017-10-05 | |||
| JP2014036129A | 2014-02-24 |
Attorney, Agent or Firm:
AKAO Kenichiro et al. (JP)
Download PDF: