STRUCTURAL MEMBER AND PREPARATION METHOD THEREFOR, AND ELECTRONIC DEVICE

WIPO Patent Application WO/2023/169429

A1

Provided in the present application are a structural member and a preparation method therefor, and an electronic device. The preparation method for a structural member comprises: performing n instances of a formation treatment on a structural member base body, wherein n ≥ 2; and after the ith instance of the formation treatment and before the (i+1)th instance of the formation treatment, performing a thinning treatment on a coating formed by the ith instance of the formation treatment, wherein i is any integer ranging from 1 to n-1; and the thinning treatment involves chemical thinning or physical thinning. By means of the preparation method, a coating structure having a high density and few defects can be formed on a structural member, and stable low resistance is achieved.

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XIONG ZHENMIN (CN)
LI HENG (CN)
GENG YONGHONG (CN)
YANG XIONG (CN)
YUAN DEZENG (CN)
XIAO WANG (CN)
ZHANG XINYI (CN)
ZHANG SHIJUN (CN)
TANG WEI (CN)

PCT/CN2023/080126

September 14, 2023

March 07, 2023

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HUAWEI TECH CO LTD (CN)

C23C22/00; H01B5/00

CN113493922A	2021-10-12
JP2010080515A	2010-04-08
TWM486236U	2014-09-11
JP2011089187A	2011-05-06
JP2003041379A	2003-02-13
CN108076608A	2018-05-25
JP2021066916A	2021-04-30

SCIHEAD IP LAW FIRM (CN)

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