Title:
STRUCTURE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2013/024689
Kind Code:
A1
Abstract:
This structure (10), which is provided with a casing (1) made of a dielectric material and a conductive member (2) embedded so as to pass through the casing (1), is manufactured by means of insert molding. A protrusion (2c) is provided on the conductive member (2), and a protrusion (40a) corresponding to the protrusion (2c) is provided on an upper mold (40). The conductive member (2) is positioned and fixed inside of the mold by means of fitting the protrusion (2c) in the protrusion (40a).
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Inventors:
KATAYAMA TOMOFUMI
KAKINOKI TAKASHI
KAKINOKI TAKASHI
Application Number:
PCT/JP2012/069253
Publication Date:
February 21, 2013
Filing Date:
July 27, 2012
Export Citation:
Assignee:
SHARP KK (JP)
KATAYAMA TOMOFUMI
KAKINOKI TAKASHI
KATAYAMA TOMOFUMI
KAKINOKI TAKASHI
International Classes:
H01P11/00; H01Q1/38
Foreign References:
JPH0993029A | 1997-04-04 | |||
JPH10247817A | 1998-09-14 | |||
JP2009246953A | 2009-10-22 |
Attorney, Agent or Firm:
HARAKENZO WORLD PATENT & TRADEMARK (JP)
Patent business corporation Hara [Kenzo] international patent firm (JP)
Patent business corporation Hara [Kenzo] international patent firm (JP)
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Claims: