Title:
STRUCTURE AND METHOD FOR MANUFACTURING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2021/261122
Kind Code:
A1
Abstract:
Provided are a structure having excellent workability and a method for manufacturing the structure. The structure includes: a plurality of columnar bodies constituted by a conductor; a substrate on which the plurality of columnar bodies are disposed along the thickness direction, in a state of being mutually electrically insulated; and a metal layer which is provided on both surfaces of the substrate in the thickness direction.
Inventors:
HOTTA YOSHINORI (JP)
Application Number:
PCT/JP2021/018884
Publication Date:
December 30, 2021
Filing Date:
May 19, 2021
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
B32B7/025; B32B5/00; B32B15/00; C23C28/00; H01B5/16
Foreign References:
| JP2019153415A | 2019-09-12 | |||
| JP2015199330A | 2015-11-12 | |||
| JP2019508612A | 2019-03-28 | |||
| JP2011091185A | 2011-05-06 |
Attorney, Agent or Firm:
ITOH Hideaki et al. (JP)
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