Title:
STRUCTURE, METHOD FOR PRODUCING ANISOTROPIC CONDUCTIVE MEMBER AND COMPOSITION FOR FORMING PROTECTIVE LAYER
Document Type and Number:
WIPO Patent Application WO/2022/163260
Kind Code:
A1
Abstract:
The present invention provides: a structure which suppresses the influence of chips that are generated by cutting works such as dicing; a method for producing an anisotropic conductive member; and a composition for forming a protective layer. This structure comprises: an insulating film; a plurality of conductors that penetrate through the insulating film in the thickness direction, while being electrically insulated from each other; a resin layer that covers at least one surface of the insulating film in the thickness direction; and a protective layer that is configured from an organic material. The resin layer is arranged between the insulating film and the protective layer; and the protective layer serves as the outermost surface layer.
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Inventors:
HOTTA YOSHINORI (JP)
Application Number:
PCT/JP2021/048168
Publication Date:
August 04, 2022
Filing Date:
December 24, 2021
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
H01R11/01; H01R43/00
Domestic Patent References:
| WO2019039071A1 | 2019-02-28 | |||
| WO2020158484A1 | 2020-08-06 |
Foreign References:
| JPH05217786A | 1993-08-27 |
Attorney, Agent or Firm:
ITOH Hideaki et al. (JP)
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