Title:
STRUCTURE FOR MOUNTING ELECTRONIC DEVICES
Document Type and Number:
WIPO Patent Application WO/1986/005061
Kind Code:
A1
Abstract:
In a highly densely packaged electronic equipment, the mounting structure enables the electric power to be supplied from the power source to a printed-circuit board through a minimum distance without any voltage drop, and enables the power source and the printed-circuit board to be stably cooled by a common cooling fan, wherein the power source, a bus plate and the printed-circuit board are integrally assembled and connected together in a unitary structure.
Inventors:
ONO IZUMI (JP)
TAKAYAMA HARUO (JP)
TAKAHASHI YASUO (JP)
OKUMURA EICHIRO (JP)
TAKAYAMA HARUO (JP)
TAKAHASHI YASUO (JP)
OKUMURA EICHIRO (JP)
Application Number:
PCT/JP1986/000057
Publication Date:
August 28, 1986
Filing Date:
February 12, 1986
Export Citation:
Assignee:
FUJITSU LTD (JP)
International Classes:
H05K7/02; H05K7/14; H05K7/20; (IPC1-7): H05K7/02; H05K7/14; H05K7/20
Foreign References:
| JPS60200596A | 1985-10-11 |
Other References:
See also references of EP 0214296A4
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