Title:
STRUCTURE PROVIDED WITH COPPER PLATING LAYER OR COPPER ALLOY PLATING LAYER
Document Type and Number:
WIPO Patent Application WO/2020/226116
Kind Code:
A1
Abstract:
This structure is provided with a copper plating layer or copper alloy plating layer in which formation of a Kirkendall void is suppressed. The copper plating layer or copper alloy plating layer is formed by carrying out an electroplating treatment at a predetermined first negative electrode current density using a copper or copper alloy electroplating bath and by subsequently completing the electroplating treatment after changing the density to a second negative electrode current density which is lower than the first negative electrode current density. The first negative electrode current density is a single negative electrode current density used during the electroplating treatment until the density is changed to the second negative electrode current density, or is the average negative electrode current density in an electroplating treatment using a combination of multiple negative electrode current densities, and the predetermined first negative electrode current density is 5A/dm2 or higher. The layer formed after the change to the second negative electrode current density is the surface part of the copper plating layer or copper alloy plating layer, and the thickness of the surface part is 0.05 µm to 15 µm.
Inventors:
HATABE MASARU (JP)
MURAKAMI HIRONORI (JP)
YAMAOKA FUKA (JP)
MURAKAMI HIRONORI (JP)
YAMAOKA FUKA (JP)
Application Number:
PCT/JP2020/018233
Publication Date:
November 12, 2020
Filing Date:
April 30, 2020
Export Citation:
Assignee:
ISHIHARA CHEMICAL CO LTD (JP)
International Classes:
C25D5/10; C25D5/18; C25D21/12
Foreign References:
| JP2008308749A | 2008-12-25 |
Attorney, Agent or Firm:
ISEKI Katsumori et al. (JP)
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