Title:
STRUCTURE FOR SECURING MEDIUM TO BE ENGRAVED
Document Type and Number:
WIPO Patent Application WO/2017/025994
Kind Code:
A1
Abstract:
A structure for securing a medium to be engraved in which a sheet- or thin-plate-form medium to be engraved is secured, by vacuum chucking, to an image-engraving device for fine-engraving the surface of the medium to be engraved using a engraving needle that vibrates on the basis of an engraving signal, wherein said structure is provided with a porous planar member (19) in which micropores that enable precise engraving to be performed while securing the medium to be engraved by vacuum chucking are open on a flat porous planar part (19a), and an air suctioning part (21) for producing suction via the micropores, whereby the adhesion of the medium to be engraved is improved, and precise engraving is accurately performed.
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Inventors:
HOSHIYAMA YUICHI (JP)
Application Number:
PCT/JP2015/004022
Publication Date:
February 16, 2017
Filing Date:
August 11, 2015
Export Citation:
Assignee:
SEMCO CORP (JP)
International Classes:
B44B3/00; B23Q3/08
Foreign References:
| JP2002086993A | 2002-03-26 | |||
| US20130068592A1 | 2013-03-21 | |||
| JP2012206247A | 2012-10-25 | |||
| JP2009076720A | 2009-04-09 |
Attorney, Agent or Firm:
SUDO, Yuichi (JP)
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