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Patent Searching and Data


Title:
STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2021/140751
Kind Code:
A1
Abstract:
A structure (1) has an aluminum substrate (111), and an adhesive layer (12) comprising an adhesive resin adhering to the surface of the aluminum substrate (111). The adhesive layer (12) comprises: a hard layer (121) contacting the adhesion interface (131) with the aluminum substrate (111); and a body layer (123) contacting the hard layer (121). The hard layer (121) is harder than the body layer (123).

Inventors:
SAITO MASAMI (JP)
Application Number:
PCT/JP2020/042952
Publication Date:
July 15, 2021
Filing Date:
November 18, 2020
Export Citation:
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Assignee:
DENSO CORP (JP)
International Classes:
C09J163/00; B32B15/08; B32B15/092; C09J183/04
Domestic Patent References:
WO2017195808A12017-11-16
WO2017006805A12017-01-12
Foreign References:
JPH0881784A1996-03-26
JP2006509106A2006-03-16
Attorney, Agent or Firm:
AICHI, TAKAHASHI, IWAKURA & ASSOCIATES (JP)
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