Title:
STYRENE BASED RESIN COMPOSITION, FORMED PARTICLE THEREOF, AND OPTICAL ELEMENT
Document Type and Number:
WIPO Patent Application WO/2013/051588
Kind Code:
A3
Abstract:
A styrene based resin composition having a low linear thermal expansion coefficient and high formability, a formed article thereof, and an optical element made from the formed article are provided. The formed article is produced by forming a styrene based resin composition containing a styrene based resin and silica particles, wherein the number average particle diameter of primary particles of the silica particles is 0.5 nm or more and 40 nm or less, and the content of the silica particles is 40 percent by volume or more and 75 percent by volume or less relative to a total of the styrene based resin and the silica particles.
Inventors:
OISHI EMI (JP)
Application Number:
PCT/JP2012/075586
Publication Date:
July 18, 2013
Filing Date:
September 26, 2012
Export Citation:
Assignee:
CANON KK (JP)
International Classes:
C08K3/36
Foreign References:
| US20050153187A1 | 2005-07-14 | |||
| JP2006291197A | 2006-10-26 | |||
| JP2006007657A | 2006-01-12 |
Attorney, Agent or Firm:
ABE, Takuma et al. (30-2 Shimomaruko 3-chome, Ohta-k, Tokyo 01, JP)
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