Title:
STYRENE RESIN COMPOSITION, AND MOLDED ARTICLE THEREOF
Document Type and Number:
WIPO Patent Application WO/2012/046809
Kind Code:
A1
Abstract:
Provided are a styrene resin composition for use in electronic component packaging such as embossed carrier tape, a sheet which has a large drawing ratio (pocket depth) and in which pockets exhibiting superior transparency and strength and can be thermoformed, and a carrier tape which is thermoformed from the sheet and which allows the verification of letters and the like formed on packaged electronic components from outside the pockets. The electronic component packaging sheet comprises: (A) 29-65 mass parts of a styrene-conjugated diene block copolymer; (B) 51-15 mass parts of a polystyrene resin; and (C) 20-9 mass parts of an impact resistant polystyrene resin. Components (A)-(C) each have a weight average molecular weight (Mw) within a specified range.
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Inventors:
FUJIWARA JUMPEI (JP)
KAWATA MASATOSHI (JP)
KAWATA MASATOSHI (JP)
Application Number:
PCT/JP2011/073112
Publication Date:
April 12, 2012
Filing Date:
October 06, 2011
Export Citation:
Assignee:
DENKI KAGAKU KOGYO KK (JP)
FUJIWARA JUMPEI (JP)
KAWATA MASATOSHI (JP)
FUJIWARA JUMPEI (JP)
KAWATA MASATOSHI (JP)
International Classes:
B65D65/02; B65D73/02; C08J5/18; C08L25/04; C08L51/04; C08L53/02
Domestic Patent References:
| WO2009081963A1 | 2009-07-02 |
Foreign References:
| JP2010174166A | 2010-08-12 | |||
| JP2003055526A | 2003-02-26 | |||
| JP2006232914A | 2006-09-07 |
Attorney, Agent or Firm:
SONODA Yoshitaka et al. (JP)
Yoshitaka Sonoda (JP)
Yoshitaka Sonoda (JP)
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Claims: