Title:
SUB MODULE
Document Type and Number:
WIPO Patent Application WO/2021/157876
Kind Code:
A1
Abstract:
A sub module is disclosed. The sub module according to an embodiment of the present invention comprises a printed circuit board connected to an IGBT in a manner capable of conducting electricity. The printed circuit board is accommodated in an internal space of an insulating housing. An insulating layer is positioned between the printed circuit board and the surface of the insulating housing in contact with the printed circuit board. The insulating layer is formed with insulating material and blocks electromagnetic noises generated in the IGBT and the printed circuit board. The IGBT and the printed circuit board can each be grounded. Therefore, the electromagnetic noises generated in the IGBT and the printed circuit board can be bypassed and discharged to the outside.
Inventors:
KANG DAECHUL (KR)
YANG SEUNGPIL (KR)
YANG SEUNGPIL (KR)
Application Number:
PCT/KR2021/000056
Publication Date:
August 12, 2021
Filing Date:
January 05, 2021
Export Citation:
Assignee:
LS ELECTRIC CO LTD (KR)
International Classes:
H02M7/00; H01R25/16; H05K5/04; H05K9/00
Foreign References:
| KR101000313B1 | 2010-12-13 | |||
| KR20180005343A | 2018-01-16 | |||
| KR20190007644A | 2019-01-23 | |||
| KR20190101678A | 2019-09-02 | |||
| KR20130111005A | 2013-10-10 |
Attorney, Agent or Firm:
PARK, Jang-Won (KR)
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