Title:
SUBMOUNT, SUBMOUNT HAVING SEMICONDUCTOR ELEMENT MOUNTED THERETO, AND SEMICONDUCTOR ELEMENT MODULE
Document Type and Number:
WIPO Patent Application WO/2017/138666
Kind Code:
A1
Abstract:
Provided is a submount which is mounted to a base comprising a metal and which has a semiconductor element mounted thereon, the submount being equipped with a substrate, a first coating layer formed on a first surface of the substrate and comprising a material which exhibits a greater coefficient of thermal expansion than does the substrate, and a second coating layer formed on a second substrate surface positioned on the opposite side thereof from the first surface, and comprising a material which exhibits a greater coefficient of thermal expansion than does the substrate, wherein the surface area covered by the second coating layer is smaller than the surface area covered by the first coating layer. As a result, when configuring a semiconductor element module by mounting a semiconductor element to the submount, it is possible to suppress a decline in the properties of the semiconductor element and reliability thereof.
Inventors:
MINATO RYUICHIRO (JP)
OHKI YUTAKA (JP)
OHKI YUTAKA (JP)
Application Number:
PCT/JP2017/005106
Publication Date:
August 17, 2017
Filing Date:
February 13, 2017
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
H01S5/023; H01L23/12; H01L23/13; H01L23/36; H01S5/0233
Foreign References:
| JP2015176925A | 2015-10-05 | |||
| JP2014072277A | 2014-04-21 | |||
| JP2006344743A | 2006-12-21 | |||
| JP2012089585A | 2012-05-10 | |||
| JP2008172141A | 2008-07-24 | |||
| JP2010278364A | 2010-12-09 | |||
| JP2017017297A | 2017-01-19 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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