Title:
SUBMOUNT AND MANUFACTURING METHOD THEREOF
Document Type and Number:
WIPO Patent Application WO/2005/098931
Kind Code:
A1
Abstract:
A submount structure for simply controlling wettability of an Sn-Zn based solder formed on a metallized layer. Of the metallized layer, a surface of a region adjacent to a region directly under an Sn-An based solder is formed of an Au-Zn based alloy to function as a broad solder resist to the Sn-An based solder.
Inventors:
MATSUSHIMA NAOKI (JP)
HIROSE KAZUHIRO (JP)
SEKI MASATOSHI (JP)
TAKEMORI HIDEAKI (JP)
KOIZUMI TOSHIAKI (JP)
FUJINAGA TAKERU (JP)
HATA SHOHEI (JP)
HIROSE KAZUHIRO (JP)
SEKI MASATOSHI (JP)
TAKEMORI HIDEAKI (JP)
KOIZUMI TOSHIAKI (JP)
FUJINAGA TAKERU (JP)
HATA SHOHEI (JP)
Application Number:
PCT/JP2005/003278
Publication Date:
October 20, 2005
Filing Date:
February 28, 2005
Export Citation:
Assignee:
HITACHI LTD (JP)
MATSUSHIMA NAOKI (JP)
HIROSE KAZUHIRO (JP)
SEKI MASATOSHI (JP)
TAKEMORI HIDEAKI (JP)
KOIZUMI TOSHIAKI (JP)
FUJINAGA TAKERU (JP)
HATA SHOHEI (JP)
MATSUSHIMA NAOKI (JP)
HIROSE KAZUHIRO (JP)
SEKI MASATOSHI (JP)
TAKEMORI HIDEAKI (JP)
KOIZUMI TOSHIAKI (JP)
FUJINAGA TAKERU (JP)
HATA SHOHEI (JP)
International Classes:
B23K35/26; C22C13/00; C23C14/14; H01L21/52; H01L23/40; H01S5/022; H05K3/34; (IPC1-7): H01L21/52
Domestic Patent References:
| WO2002005609A1 | 2002-01-17 |
Foreign References:
| JP2002359459A | 2002-12-13 | |||
| JP2001156207A | 2001-06-08 | |||
| JP2001298051A | 2001-10-26 |
Attorney, Agent or Firm:
Ogawa, Katsuo (3-3 Shinkawa 1-chom, Chuo-ku Tokyo, JP)
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