SUBMOUNT, OPTICAL MODULE PROVIDED THEREWITH, AND SUBMOUNT MANUFACTURING METHOD

WIPO Patent Application WO/2010/140604

A1

In order to simplify submount manufacture, and increase the manufacturing efficiency thereof, a first electrode layer (12) is formed as a layer on the surface of a submount substrate (11); a side surface (122) of the first electrode layer (12) is formed on substantially the same plane as a side surface (112) of the submount substrate (11); and the side surface (122) of the first electrode layer (12) is a connection surface for creating an electrical connection with the first electrode layer (12). By making the first electrode layer (12) sufficiently thick, the surface area of the side surface (122) can be made sufficiently large. This allows, for example, wire bonding using this side surface (122). Further, components such as an optical element (14) can be protected by a sealing material (16).

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SONG XUELIANG (JP)
YIT FOO CHEONG (JP)
HORIGUCHI KATSUMASA (JP)
WANG SHURONG (JP)

PCT/JP2010/059310

December 09, 2010

June 02, 2010

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ADVANCED PHOTONICS INC (JP)
SONG XUELIANG (JP)
YIT FOO CHEONG (JP)
HORIGUCHI KATSUMASA (JP)
WANG SHURONG (JP)

H01L33/62; G02B6/42; H01L21/52; H01L25/00; H01L31/02; H01S5/023

JP2007158009A	2007-06-21
JP2008010486A	2008-01-17
JP2008218678A	2008-09-18
JPH0951053A	1997-02-18
JP2002014258A	2002-01-18
JPH10261820A	1998-09-29
JPH03184384A	1991-08-12
JP2001141969A	2001-05-25
JPH1168171A	1999-03-09
JP2008235469A	2008-10-02
JP2009071264A	2009-04-02
JPH10223817A	1998-08-21

NARUSE, SHIGEO (JP)
Shigeo Naruse (JP)

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