Title:
SUBSTRATE-AND-ADHESIVE LAYER INTEGRATED SHEET FOR FLEXIBLE DEVICE, AND PRODUCTION METHOD OF FLEXIBLE DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/112685
Kind Code:
A1
Abstract:
A substrate-and-adhesive layer integrated sheet for a flexible device, in which a flexible film and an adhesive layer are laminated together, wherein the absolute value of the difference between the surface free energy of the flexible film and the surface free energy of the cured layer formed by curing the adhesive layer is 30 dyn/cm or less and the storage elastic modulus of the cured layer is 5.0 GPa or less, and a production method of a flexible device using the same.
Inventors:
SAKAI KOYUKI (JP)
TOKUHISA KENJI (JP)
TOKUHISA KENJI (JP)
Application Number:
PCT/JP2022/044271
Publication Date:
June 22, 2023
Filing Date:
November 30, 2022
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
C09J11/06; B32B7/04; C09J7/30; C09J201/00; C09J201/06; G09F9/00; G09F9/30
Domestic Patent References:
| WO2011125099A1 | 2011-10-13 | |||
| WO2020251030A1 | 2020-12-17 | |||
| WO2017158994A1 | 2017-09-21 |
Foreign References:
| JP2016126130A | 2016-07-11 | |||
| JP2014097595A | 2014-05-29 | |||
| JP2020105061A | 2020-07-09 | |||
| JP2003216060A | 2003-07-30 | |||
| JP2018028974A | 2018-02-22 | |||
| CN112625623A | 2021-04-09 | |||
| JP2021204360A | 2021-12-16 |
Attorney, Agent or Firm:
IIDA & PARTNERS et al. (JP)
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