SUBSTRATE BONDING APPARATUS, ALIGNING APPARATUS, SUBSTRATE BONDING METHOD, ALIGNING METHOD, AND LAMINATED SEMICONDUCTOR DEVICE MANUFACTURING METHOD

WIPO Patent Application WO/2014/064944

A1

There has been a problem of generating a positional shift between substrates due to factors after alignment, even if the substrates are accurately aligned with each other. This substrate bonding apparatus that bonds a first substrate and a second substrate to each other is provided with: an aligning unit that aligns the first substrate and the second substrate to each other by means of an aligning apparatus; a transfer unit that carries out the first substrate and the second substrate from the aligning unit, said first substrate and the second substrate having been aligned with each other; a bonding unit that bonds the first substrate and the second substrate to each other, said first substrate and the second substrate having been transferred by means of the transfer unit; and a determining unit that determines, after the substrates are aligned with each other by means of the aligning unit and prior to carrying out the substrates by means of the transfer unit, whether there is a positional shift between the first substrate and the second substrate.

JP2016048505	SUBSTRATE PROCESSING DEVICE
JP3460177	METHOD AND SYSTEM FOR TRANSFERRING SUBSTRATE AND MEMBER FOR TRANSFERRING SUBSTRATE USED THEREIN
JP2014229772	PROCESSING APPARATUS

OKAMOTO KAZUYA (JP)
SUGAYA ISAO (JP)

PCT/JP2013/006334

May 01, 2014

October 25, 2013

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NIKON CORP (JP)

H01L21/68; H01L21/02

WO2010023935A1	2010-03-04
WO2008156152A1	2008-12-24

JP2008172093A	2008-07-24
JP2010087377A	2010-04-15
JP2005251972A	2005-09-15

See also references of EP 2913841A4

RYUKA IP LAW FIRM (JP)
Ryuka international patent business corporation (JP)

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