Title:
SUBSTRATE BONDING DEVICE, LAMINATE MANUFACTURING METHOD, AND IMAGE DISPLAY DEVICE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2016/031978
Kind Code:
A1
Abstract:
In order to accurately bond together two substrates without air bubbles entering the adhesive layer interface between the first substrate and the second substrate even when the first substrate is warped or when warping occurs during bonding, this substrate bonding device is provided with a flexible flat plate-shaped member 12 which holds a liquid crystal panel 106 by suction, a hanger unit 14 which suspends the flexible plate-shaped member 12 on a window glass 102, a curvature member 24 which causes the flexible plate-shaped member 12 to curve, and a roller 16 which presses from the back surface of the flexible plate-shaped member 12 towards the window glass 102 to apply a bonding load.
Inventors:
ITOH YASUNORI (JP)
TATEYAMA YUUKI (JP)
HORI YUUKI (JP)
TATEYAMA YUUKI (JP)
HORI YUUKI (JP)
Application Number:
PCT/JP2015/074489
Publication Date:
March 03, 2016
Filing Date:
August 28, 2015
Export Citation:
Assignee:
ASAHI GLASS CO LTD (JP)
International Classes:
G09F9/00; G02F1/13; G02F1/1333
Domestic Patent References:
| WO1999017327A1 | 1999-04-08 |
Foreign References:
| JP2009145795A | 2009-07-02 | |||
| JPH10199422A | 1998-07-31 | |||
| JP3071980U | 2000-09-29 | |||
| JP2015120298A | 2015-07-02 |
Attorney, Agent or Firm:
SENMYO, Kenji et al. (JP)
Spring name Kenji (JP)
Spring name Kenji (JP)
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