Title:
SUBSTRATE BONDING METHOD AND LAMINATED BODY PRODUCTION METHOD
Document Type and Number:
WIPO Patent Application WO/2018/052045
Kind Code:
A1
Abstract:
Provided are: a substrate bonding method which enables forming a precision minute space using a method that is simpler and easier than conventional methods; and a laminated body production method that uses said substrate bonding method. This substrate bonding method comprises: a first pressure-bonding step for disposing a first substrate on a photoresist pattern formed on a support film so as to bring the first substrate into contact with a surface of the photoresist pattern located on the side opposite to the support film, and pressure-bonding the support film, the photoresist pattern, and the first substrate; a support film release step for releasing the bonded support film after the pressure-bonding; and a second pressure-bonding step for disposing a second substrate on the photoresist pattern so as to bring the second substrate into contact with the surface of the photoresist pattern located on the side opposite to the first substrate, and pressure-bonding the first substrate, the photoresist pattern, and the second substrate.
Inventors:
MIZUSAWA RYUMA (JP)
ANDO TOMOYUKI (JP)
ANDO TOMOYUKI (JP)
Application Number:
PCT/JP2017/033138
Publication Date:
March 22, 2018
Filing Date:
September 13, 2017
Export Citation:
Assignee:
TOKYO OHKA KOGYO CO LTD (JP)
International Classes:
B29C65/78; B29C65/40; B29C65/48; B32B3/26; B32B7/14; C09J5/00; C09J7/00; C09J201/00
Foreign References:
| JP2004063694A | 2004-02-26 |
Other References:
See also references of EP 3513955A4
Attorney, Agent or Firm:
SHOBAYASHI Masayuki (JP)
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