Title:
SUBSTRATE CLEANING APPARATUS AND METHOD FOR CLEANING SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2021/085213
Kind Code:
A1
Abstract:
[Problem] To prevent reattachment of particles that have been removed from a substrate. [Solution] A substrate cleaning apparatus according to the present invention is provided with: a substrate holding part that holds a substrate; a gas nozzle that sprays a cleaning gas onto the substrate on the substrate holding part; and a nozzle cover provided surrounding the gas nozzle. The cleaning gas is sprayed inside a vacuum chamber of the nozzle cover from the gas nozzle, and a gas cluster that removes particles on the substrate is generated inside the vacuum chamber. Gas for a gas curtain is sprayed to the substrate side from an end part of the nozzle cover, and a gas curtain is formed between the end part of the nozzle cover and the substrate.
Inventors:
NAKASHIMA TSUNENAGA (JP)
AKIMOTO MASAMI (JP)
AKIMOTO MASAMI (JP)
Application Number:
PCT/JP2020/039245
Publication Date:
May 06, 2021
Filing Date:
October 19, 2020
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/304
Foreign References:
| JPH04206521A | 1992-07-28 | |||
| JP2013175681A | 2013-09-05 | |||
| JP2015026745A | 2015-02-05 | |||
| JP2007201374A | 2007-08-09 | |||
| JP2015041646A | 2015-03-02 | |||
| JPH1056004A | 1998-02-24 | |||
| JP2019117831A | 2019-07-18 | |||
| JPH07230959A | 1995-08-29 |
Attorney, Agent or Firm:
NAKAMURA Yukitaka et al. (JP)
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