Title:
SUBSTRATE CLEANING DEVICE, POLISHING DEVICE, BUFFING DEVICE, SUBSTRATE CLEANING METHOD, SUBSTRATE PROCESSING DEVICE, AND MACHINE LEARNING DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/117685
Kind Code:
A1
Abstract:
The present invention relates to: a substrate cleaning device, a polishing device, a buffing device, and a substrate processing device which have improved performance and throughput; a machine learning device which is used in any one of these; and a substrate cleaning method. A substrate cleaning device (16) is provided with: a cleaning implement (77) that cleans a substrate (W) held by substrate holding parts (71, 72, 73, 74); a surface property measuring device (60) that acquires surface data of the cleaning implement (77); and a control unit (30) that determines the replacement time for the cleaning implement (77) on the basis of the surface data. The surface property measuring device (60) acquires surface data of the cleaning implement (77) at at least two measurement points (PA, PB) on the cleaning implement (77) each time scrub cleaning has been carried out on a prescribed number of substrates (W). The control unit (30) determines the replacement time for the cleaning implement (77) on the basis of a difference between the acquired surface data.
Inventors:
ISHIBASHI TOMOATSU (JP)
Application Number:
PCT/JP2020/045509
Publication Date:
June 17, 2021
Filing Date:
December 07, 2020
Export Citation:
Assignee:
EBARA CORP (JP)
International Classes:
B08B1/04; B08B3/04; B08B7/04; H01L21/304
Foreign References:
| JP2008515171A | 2008-05-08 | |||
| JP2015220402A | 2015-12-07 | |||
| JP2015185571A | 2015-10-22 | |||
| JP2016092158A | 2016-05-23 |
Attorney, Agent or Firm:
HIROSAWA, Tetsuya et al. (JP)
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