Title:
SUBSTRATE COATING APPARATUS AND SUBSTRATE COATING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/196120
Kind Code:
A1
Abstract:
In this invention, a slit nozzle moves relative to a substrate while a notch in the substrate is located at a terminal-end position in a moving direction. As a result, processing liquid is coated on the substrate. Subsequently, the slit nozzle relatively moves away from the substrate. At this time, a liquid reservoir formed at the terminal-end position is drained, and most of the processing liquid forming the liquid reservoir remains on the notch, causing a film thickness defect. This way, the film thickness defect occurs only at the notch, and the other area is uniformly coated with the processing liquid.
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Inventors:
ABE YUJI (JP)
Application Number:
PCT/JP2022/003054
Publication Date:
September 22, 2022
Filing Date:
January 27, 2022
Export Citation:
Assignee:
SCREEN HOLDINGS CO LTD (JP)
International Classes:
B05C9/10; B05C5/02; B05C11/00; B05C11/10; B05C13/00; B05D1/26; B05D3/00; B05D7/00; H01L21/683
Domestic Patent References:
| WO2013146948A1 | 2013-10-03 |
Foreign References:
| JP2018069230A | 2018-05-10 | |||
| JP2006287181A | 2006-10-19 | |||
| JP2007335613A | 2007-12-27 | |||
| JP2005116553A | 2005-04-28 | |||
| JP2017148769A | 2017-08-31 |
Attorney, Agent or Firm:
FURIKADO, Shoichi et al. (JP)
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